China's 3G standard TD-SCDMA Industry Alliance (TDIA) members of the main chip communication Comlent (Shanghai) Co., Ltd., 30, announced the availability of self-developed TD-SCDMA RF and analog baseband engineering samples. This is also the country's first RF CMOS TD-SCDMA chipset.
RF and digital baseband wireless communication terminals tied to two core chips, the former has been the soft underbelly of China's wireless communications industry, as the only bear the TD-SCDMA radio special and the Ministry of Science and the State "863" high-tech business plan projects the RF chip , Comlent developed CMOS RF transceiver (CL4020) and analog baseband (CL4520) chipset, can support Spreadtrum, Commit, T3G and re-mail and all other domestic-based interfaces with vendors.
Chen Kai Comlent Communications CEO, said in April this year Comlent successful TD-SCDMA network call to break the RF transceiver chip companies by foreign monopoly. Comlent developed RF transceiver and analog baseband with the rapid development of companies such as digital baseband chip with each other, to jointly complete industrial chain of China's 3G chip, a complete layout.
China's TD-SCDMA Industry Alliance, Yang Hua, Secretary-General believes that the Chinese own 3G standard TD-SCDMA development of a mature industry, is an extremely arduous task. On specific projects, to support the phone functions, one of the two core chip RF transceiver chip has been China's 3G industry, wireless communications and the weak links Comlent progress made on China's domestic 3G communications industry chain and early completion of the commercial distribution play a positive role in promoting technology.
According to the latest relevant statistics, as of this June, China Mobile, the number more than 430 million users, and to an annual increase of 50 million mobile subscribers continuing the momentum of rapid development. About to start 3G services, will lead to great development of related industries.
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